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  this is information on a product in full production. march 2012 doc id 022946 rev 1 1/7 7 stps30l30djf high efficiency power schottky diode datasheet ? production data features low forward voltage drop very small conduction losses negligible switching losses avalanche rated extremely fast switching low thermal resistance 1 mm package thickness ecopack ? 2 compliant component description single schottky rectifier suited for switch mode power supply and high frequency dc to dc converters. packaged in powerflat? 5x6, this device is intended for use in low voltage high frequency inverters. tm: powerflat is a trademark of stmicroelectronics table 1. device summary symbol value i f(av) 30 a v rrm 30 v t j (max) 150 c v f (typ) 0.30 v k a a k k a a powerflat 5x6 stps30l30djf www.st.com
characteristics stps30l30djf 2/7 doc id 022946 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.27 x i f(av) + 0.006 x i f 2 (rms) table 2. absolute ratings (limiting values with anode terminals short-circuited) symbol parameter value unit v rrm repetitive peak reverse voltage 30 v i f(rms) forward rms current 45 a i f(av) average forward current = 0.5 t c = 110 c 30 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 250 a p arm repetitive peak avalanche power t p = 1 s, t j = 25 c 1300 w v arm maximum repetitive peak avalanche voltage t p <1 s, t j < 150 c, i ar < 11 a 35 v t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal r unaway for a diode on its own heatsink 150 c table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case 2 c/w table 4. static electrical characteristics (anode terminals short-circuited) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 380 s, < 2% reverse leakage current t j = 25 c v r = 30 v - - 0.75 ma t j = 125 c - 100 230 ma v f (1) forward voltage drop t j = 25 c i f = 15 a - - 0.44 v t j = 125 c i f = 15 a - 0.30 0.35 t j = 25 c i f = 30 a - - 0.51 t j = 125 c i f = 30 a - 0.38 0.45 dptot dtj < 1 rth(j-a)
stps30l30djf characteristics doc id 022946 rev 1 3/7 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p f(av) (w) 0 5 10 15 20 25 0 5 10 15 20 25 30 35 40 i f(av) (a) t =tp/t tp =0.05 =0.1 =0.2 =0.5 =1 i f(av) (a) 0 5 10 15 20 25 30 35 0 25 50 75 100 125 150 r th(j -a) =r th(j-c) t =tp/t tp t amb (c) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p p (25c) arm (tj) arm figure 5. relative variation of thermal impedance, junction to case, versus pulse duration figure 6. reverse leakage current versus reverse voltage applied (typical values) z th(j-c) /r th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse tp(s) i r (ma) 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 0 5 10 15 20 25 30 t j =150c t j =125c t j =25c t j =100c t j =75c t j =50c v r (v)
characteristics stps30l30djf 4/7 doc id 022946 rev 1 figure 7. junction capacitance versus reverse voltage applied (typical values) figure 8. forward voltage drop versus forward current c(pf) 100 1000 10000 1 10 100 f=1mhz v osc =30mv rms t j =25c v r (v) i fm (a) 0.1 1.0 10.0 100.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 t j =25c (maximum values) t j =125c (maximum values) t j =125c (typical values) v fm (v) figure 9. thermal resistance junction to ambient versus copper surface under each tab figure 10. reverse safe operating area (t p < 1 s and t j < 150 c) rth(j-a)(c/w) 0 50 100 150 200 250 012345678910 s cu (cm 2 ) epoxy printed board fr4 copper thickness = 35 m iarm (a) 3.0 5.0 7.0 9.0 11.0 13.0 15.0 30 35 40 45 50 55 60 65 70 varm (v)
stps30l30djf package information doc id 022946 rev 1 5/7 2 package information epoxy meets ul94,v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. footprint (dimensions in mm) table 5. powerflat 5x6 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 1.00 0.031 0.039 a1 0.02 0.05 0.001 0.002 a2 0.25 0.010 b 0.30 0.50 0.012 0.020 d 5.20 0.205 d2 4.11 4.31 0.162 0.170 e 1.27 0.050 e 6.15 0.242 e2 3.50 3.70 0.138 0.146 l 0.50 0.80 0.020 0.031 k 1.275 1.575 0.050 0.062 d2 e2 k l b e d e a a1 a2 1.27 0.62 0.95 0.98 6.29 4.33 3.86 5.35 4.41
ordering information stps30l30djf 6/7 doc id 022946 rev 1 figure 12. tape and reel specifications 3 ordering information 4 revision history dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 8.0 6.30 2.0 12.0 5.30 1.75 5.5 ? 1.55 ? 1.5 0.20 1.20 0.30 r 0.50 table 6. ordering information order code marking package weight base qty delivery mode STPS30L30DJF-TR ps30 l30 powerflat 5x6 0.095 g 3000 tape and reel table 7. document revision history date revision changes 16-mar-2012 1 first issue.
stps30l30djf doc id 022946 rev 1 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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